smt lead free reflow oven

  • KTE-800 lead free reflow oven machine
KTE-800 lead free reflow oven machine

KTE-800 lead free reflow oven machine

  • Heating length: 3110mm
  • weight: 2300kg
  • consumption power:10kw
  • Conveying method:mesh+ chain
  • Product description: SMT Reflow Oven, Lead free Reflow Oven, High end Reflow Oven, Reflow Soldering Oven, Reflow Oven Manufacturer, LED Reflow Oven, PCB Reflow Oven, Nitrogen Reflow Oven, Customized Reflow Oven, Dual Rail
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KTE-800 lead free reflow oven machine


Features:
1. Totally meet various requirements for the lead free processing.
2. Windows XP operation system, Chinese/English can be switched online.
3. Standard air oven, Patent air system, using hot air convection conduction heat faster, more efficient compensation.
4. PLC+PID closed loop control to achieve high precision temperature control and repeatable profiles.
5. Dual temperature sensors and dual safety control, system shall cut off the power while abnormal alarm.
6. Modular design to get quick and simple maintenance so that reducing the maintenance time & cost.

Machine Specification

Model

KTE-800

Control

Industrial computer

Heating zones qty.

Top 8, bottom 8

Cooling zones qty.

Top 2

Heating zone length

3110mm

Rectifying plate

Galvanized plate

Weight

Approx.:2300KG

Dimension

5310*1360*1490mm

Exhaust capacity

10/min×2

Color

Grey

Control system

Electricity supply

3P 380V/220V 50/60HZ

Temp. control range

Room temp.300℃

Total power

64KW

Temp. control accuracy

±1℃static state

Start power

30KW

Temp. control method

PID +SSR drive

Consumption power

10KW

PCB temperature deviation

±1.5℃

Speed control

Inverter adjust

Data save

All profiles can be saved

Warm up time

Approx.30minute

Abnormal alarm

High, low temp. alarm

Conveying system

Rail structure

2 sectional rails

Rail fixed method

Front fix

Chain

Stuck-free type

Conveying height

900±20mm

PCB Max. width

50-400mm

Conveying method

mesh+ chain

Component height

Top/bottom 25mm

Conveying speed

300-2000mm

Conveying direction

Left to right

Lubrication

Automatic

Cooling system

Cooling method

Forced air cooling

Heating features

Heating zones

Top 8,bottom 83110mmcan meet the need of the peak lead-free technique.

Cooling zones

After cool down by air, PCB temp. is ≤70℃ at the exit.

Warm up time

From the normal temp. to set temp, approximate 30 minutes.

Warm up sequence

Warm up from two side, save the power and time

Profile transfer time

15min

Heating zone temp. control accuracy

±1℃

PCB temp. deviation

±1.5℃

Empty to full load heat balance respond time

≤20 s

Keywords:

SMT Reflow Oven, Lead free Reflow Oven, High end Reflow Oven, Reflow Soldering Oven, Reflow Oven Manufacturer, LED Reflow Oven, PCB Reflow Oven, Nitrogen Reflow Oven, Customized Reflow Oven, Dual Rail Reflow Oven, China Reflow Oven.

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